Over the past few months, the AddMorePower consortium has been actively sharing its research at leading international conferences and fairs across Europe and Asia. These events provided valuable opportunities to present project results, connect with the global materials science community, and discuss the latest advances in semiconductor and quantum technologies.
20th International Conference on Strength of Materials (ICSMA20) – Kyoto, Japan
A PhD student from Université de Lorraine presented the talk “Effect of free surfaces on dislocation elastic fields: application to threading dislocations in GaN.” ICSMA20 served as a global platform for discussions on the latest progress in materials strength research, focusing on metals, alloys, composites, biomedical, and emerging materials.
World of Quantum – Munich, Germany
At the World of Quantum fair, our partner ESRF represented AddMorePower at their stand. The event is one of the world’s leading trade fairs for quantum technology, featuring more than 160 companies, startups, and research institutions presenting developments in quantum computing, communication, and sensor technology. It was a great opportunity to showcase our project in a highly innovative and cross-disciplinary environment.
Advanced Materials Show – Birmingham, United Kingdom
ESRF also represented AddMorePower at the Advanced Materials Show, engaging with visitors at the ESRF booth and taking part in the panel discussion “Advances in Materials Characterisation.” The event brought together researchers and industry professionals to discuss the latest innovations in advanced materials used across technology sectors.
15th International Conference on Nitride Semiconductors (ICNS-15) – Malmö, Sweden
At ICNS-15, a researcher from ESRF presented “Operando Strain Microscopy in GaN/Si High Electron Mobility Transistors with Nanosecond Time Resolution.” The presentation highlighted the use of advanced synchrotron techniques to study strain evolution in nitride-based electronic devices under real operating conditions.
International Conference on Solid State Devices and Materials (SSDM) – Yokohama, Japan
Most recently, ESRF participated in the SSDM Conference, where Cédric Corley-Wizak presented “Multi-Scale Strain Landscape of Al₁₋ₓGaₓN/GaN/Si Heterostructures Probed by X-ray Diffraction Microscopy” on 16 September.
A few days later, on 19 September, he chaired the 318th SPring-8 Seminar, titled “Spatiotemporal Imaging of Lattice Strain in Microelectronic Devices at Beamline ID01.” Both activities emphasized the project’s strong contributions to the field of advanced X-ray characterisation for semiconductor research.
Through these events, AddMorePower continues to strengthen its presence in the international research community, fostering collaboration and promoting scientific excellence in materials modeling and characterisation.
