The AddMorePower project was represented at the World Congress on Computational Mechanics (WCCM 2026), one of the leading international events for computational mechanics, materials modelling, and simulation.
Martin Diehl (KU Leuven) and Manuel Petersmann (KAI Gmbh / Infineon technologies Austria AG) presented research related to the modelling and simulation of materials and processes relevant to power semiconductor technologies.
Martin Diehl delivered the presentations “Thermo-Chemo-Mechanical Modelling of Thermally Loaded Metallization Layers” and “DAMASK – The Düsseldorf Advanced Material Simulation Kit”, highlighting advanced approaches for understanding material behaviour and supporting reliable semiconductor device development.
Manuel Petersmann presented “Damage Evolution in Lead-Free Solder Joints: Industrial Setting, Computational Mechanics and Data Perspective” within the symposium on chemo-mechanical coupling phenomena in solids, addressing reliability challenges in electronic components.
Participation in WCCM 2026 provided an excellent opportunity to exchange knowledge with the international research community and showcase expertise developed within the AddMorePower consortium.
Martin Diehl (KU Leuven) and Manuel Petersmann (KAI/IFAT) representing the AddMorePower project at WCCM 2026.
