Over the past weeks, AddMorePower was actively represented at four major scientific events. At ICACC 2026, our partners contributed to discussions on advanced ceramics and wide-bandgap semiconductor materials. At the 15th International Conference on Industrial Computed Tomography (iCT) in Linz, Fraunhofer IKTS presented work on in-situ tomography of copper metallization layers. During the annual User Meeting of the ESRF in Grenoble, KAI and ESRF shared insights on synchrotron-based characterization and diffraction microscopy. Finally, ESRF presented a poster at the International Conference on Frontiers of Characterization and Metrology for Nanoelectronics 2026, contributing to discussions on next-generation analytical methods for nanoelectronics. Together, these events provided excellent opportunities to disseminate results, strengthen collaborations, and gather feedback as the project enters its final phase.
Looking ahead, the consortium is preparing for two key events this Spring. Our partner ESRF will attend SPIE Photonics Europe, presenting insights on synchrotron-supported materials characterization. In parallel, KAI will deliver a keynote at the MecaNano General Meeting, contributing to discussions on nanoscale mechanics, modelling, and semiconductor reliability. These upcoming events mark an important moment for disseminating our results as AddMorePower enters its final project phase.
