From July 13-16, 2026, Sebastian Moser (KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH) and Till Dreier (Excillum AB) attended the IEEE IPFA 2026 conference in Singapore. Sebastian Moser gave a talk titled “In-situ X-ray tomography of Cu fatigue in power microelectronics”. The presented work was carried out within the AddMorePower project, with contributions from the collaboration partners KAI Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Excillum AB, and Fraunhofer IKTS. The conference made clear that innovative characterization methods are essential for the development, process control, and failure analysis of advanced microelectronic components, and that the work within AddMorePower actively drives progress in these fields.
